18th IAPRI WORLD PACKAGING CONFERENCE WELCOMES YOU TO THE HAPPIEST PLACE IN AMERICA


The Cal Poly Packaging Program is honored to host the 18th IAPRI World Packaging Conference June 17-21, 2012. The event will coincide with the Cal Poly Packaging Program’s 25th anniversary, and we are delighted to celebrate this milestone with the international packaging community. Global packaging experts from academia and industry will gather in San Luis Obispo for what we envision to be a highly educational, exciting and memorable event. Attendees will also have a chance to explore and enjoy the many pleasures the Central Coast of California has to offer. The Preliminary Schedule, Conference Research Areas, Preliminary Paper and Poster Deadlines, Abstract Selection Criteria, and Registration Information are detailed here.

Click here for Conference Brochure

KEYNOTE PRESENTATION

Click Here for Bios
Dr. Michael Okoroafor
Global Packaging Trends in the Food and Beverage Industries
Dr. Amar K. MohantyPlastics and Sustainability: Future of Bioplastics and Biomaterials in the New Green Economy
Mr. James PorterNorth American Containerboard Supply to Global Markets and the Important Role for Innovation in Corrugated Packaging Today
Mr. Kevin D. Smith and Mr. Layke FranklinPackaging and Logistics to Support the War Fighter

CONFERENCE PRESENTATIONS AREAS

1.   Active & Intelligent Packaging
2.   Distribution Packaging
3.   Medical, Cosmetic & Pharmaceutical Packaging
4.   Packaging Design, Printing & Graphics
5.   Packaging for Food & Agriculture
6.   Packaging for Hazardous & Dangerous Goods
7.   Packaging Innovations & Development
8.   Packaging Machinery & Systems
9.   Packaging Materials & Containers
10. Packaging Sustainability
11. Packaging Testing & Standards

SCIENTIFIC COMMITTEE

  • Rafael Auras, Michigan State Univeristy, USA
  • Laura Bix, Michigan State Univeristy, USA
  • Ingo Bueren, IPI International Packaging Institute, Switzerland
  • Vanee Chonhenchob, Kasetsart University, Thailand
  • Kay Cooksey, Clemson, USA
  • Duncan Darby, Clemson, USA
  • Mikael Gallstedt, Innventia , Sweden
  • Rafael Gavara, IATA-CSIC, Spain
  • Changfeng G, Rochester Inst. Tech., USA
  • Thomas Goedecke, BAM, Germany
  • Dan Goodwin, Rochester Inst. Tech., USA
  • Bruce Harte, Michigan State Univeristy, USA
  • Mercedes Hortal, ITENE, Spain
  • Eero Hurme, VTT Technical Research Centre of Finland, Finland
  • Kennert Johansson, Innventia, Sweden
  • Per-Åke Johansson, Innventia, Sweden
  • Robert Kimmel, Clemson, USA
  • Siv Lindberg, Innventia, Sweden
  • Manuel García Martínez, ITENE, Spain
  • Christina Nerin, Universidad de Zaragoza, Spain
  • Søren Østergaard, Danish Technological Institute, Denmark
  • Vincent Rouillard, Victoria University, Australia
  • Michael Sek, Victoria Univ, Australia
  • Susan Selke, Michigan State Univeristy, USA
  • Paul Singh, Michigan State Univeristy, USA
  • Jay Singh, Cal Poly State University, USA
  • Diane Twede, Michigan State Univeristy, USA
  • Zhi-Wei Wang,Jinan University, China
  • Yves Wyser, Nestlé Research Center, Switzerland